Siemens EDA Solido Custom IC Forum 2026
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活動介紹
活動簡介
Siemens EDA Solido Custom IC Forum 2026 正值 Custom IC 設計與驗證的重要轉捩點。隨著 AI 正在重新塑造設計流程的各個階段，AI Agent 也正重新定義 Custom IC 設計的可能性。
活動內容
本次一日活動將邀請業界專家與客戶分享實務洞察，涵蓋多項關鍵 IC 設計與驗證議題，包括電路模擬、混合訊號驗證、3 至 6+ Sigma 變異分析、Library Characterization、IP QA，以及 Layout 與 Schematic Capture。
活動也將展示 Solido Custom IC 產品組合中的 Agentic Workflow，深入了解 AI Agent 如何改變工程師進行整體 Custom IC 設計流程的方式，進一步提升設計效率。
透過實際客戶案例與產品 Demo，您將了解業界領先企業如何導入 Solido AI 解決方案，解決複雜的設計挑戰，並實現顯著的生產力提升。
時間與地點
2026 年 9 月 17 日 (Tue.)｜09:30 - 16:00
費用與報名
活動議程
| 時間 | 議程 | 主講者 |
|---|---|---|
| 9:30 – 10:00 | Registration & Welcome | - |
| 10:00 - 10:30 | Keynote — 敬請期待 | Lincoln Lee (VP of Application Engineering, Pac-Rim, Siemens EDA) |
| 10:30 - 11:00 | Keynote — From Tools to Agents: Scaling Autonomous Custom IC Workflows with Solido | Sathishkumar Balasubramanian (Head of Products - EDA AI & Solid, Siemens EDA) |
| 11:00 - 11:30 | Breaking verification barriers: AI-accelerated Solido Simulation Suite for IC design sign-off | Neel Natekar (Senior Product Manager, Siemens EDA) |
| 11:30 - 11:45 | Break | - |
| 11:45 - 12:15 | AI-powered silicon-proven variation-aware verification and optimization with Solido Design Environment (SDE) | Lih-Jen Hou (Technical Product Manager, Siemens EDA) |
| 12:15 - 12:30 | Industry Expert Experience Session — 敬請期待 | 敬請期待 |
| 12:30 - 14:00 | Lunch & Networking | - |
| 14:00 - 14:30 | Layout Is the New Schematic: Accelerate Design and Analysis with Solido’s latest AI-Powered Layout Solutions | Lih-Jen Hou (Technical Product Manager, Siemens EDA) |
| 14:30 - 15:00 | Staying Ahead of Characterization Schedules with the AI-Powered Solido Characterization Suite | Cooper Robertson (Technical Product Manager, Siemens EDA) |
| 15:00 - 15:15 | Industry Expert Experience Session — 敬請期待 | 敬請期待 |
| 15:15 - 15:45 | Closing IP quality gaps at every revision with AI-Powered Solido IP Validation Suite (IPV) | Cooper Robertson (Technical Product Manager, Siemens EDA) |
| 15:45 - 16:00 | Industry Expert Experience Session — 敬請期待 | 敬請期待 |
- 活動主辦單位保留議程內容變更、活動流程變更之所有權利 -
講者/表演者
- Lincoln Lee
VP of Application Engineering, Pac-Rim, Siemens EDA - Sathishkumar Balasubramanian
Head of Products - EDA AI & Solid, Siemens EDA - Neel Natekar
Senior Product Manager, Siemens EDA - Lih-Jen Hou
Technical Product Manager, Siemens EDA - Cooper Robertson
Technical Product Manager, Siemens EDA
